Bulg. J. Phys. vol.45 no.1 (2018), pp. 035-043

Influence of Substrates on the Electrical Properties of Thin Tin Films

L.U. Shiva1, N.H. Ayachit1, L.A. Udachan2, A.V. Banagar3, S.S. Kolkundi3, S.S. Bhairamadagi4
1Department of Physics, Rani Channamma University, Belagavi-591 156, Karnataka, India
2Channabasaveshwar Post Graduate Studies & Research Centre, Bhalki, Dist: Bidar, Karnataka, India
3Government First Grade College, Shahapur-585 223, Dist: Yadgir, Karnataka, India
4Government Degree College, Kalaburagi-585 105, Karnataka, India
Abstract. Substrate material plays a vital role in defining the physical characteristics of vacuum deposited films and happens to be one of the important deposition parameters, similar to that of film thickness. By the proper choice of deposition parameter or selected combination of deposition parameters, it is possible to grow films of specific characteristics for specific application. The use of soda glass substrate has been the most common material for film deposition, and other substrates like, quartz, mica, Teflon are growing in importance. An attempt is made to study their effect on the electrical resistivity of thin tin films, in the thickness range 40–160 nm. We have made use of Fuchs size effect and Mayadas–Shatzkes theories for analyzing the electrical resistivity data, for tin films grown on glass and quartz substrates. The infinitely thick film resistivity, conduction electron mean free path and specularity parameter are found to depend upon the nature of substrate and the binding force between substrates and evaporated tin atoms. In order to confirm the material used under present investigation is tin, the Electron Dispersive Spectroscopy (EDS) analysis of film has been undertaken using Scanning Electron Microscope (SEM).

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